Best US Companies To Buy Right Now

Best US Companies To Buy Right Now: Electro Scientific Industries Inc (ESIO)

Electro Scientific Industries, Inc. (ESI) incorporated on April 19, 1949, is a supplier of laser-based manufacturing solutions for the microtechnology industry. The Company operates high-technology manufacturing equipment, which consists of products that are organized in three groups: interconnect & microfabrication, semiconductor and components. The Companys laser systems enable precise structuring of micron to submicron features in components and devices which are used in a wide variety of end products in the consumer electronics, computer, semiconductor, communications and other markets. Its laser microfabrication systems allow microelectronics, semiconductor, and other microtechnology manufacturers to physically alter select device features during high-volume production. In June 2012, it acquired Eolite Systems.

The Companys laser-based systems improve production yields or enable improved performance for flexible and rigid high density interconnect printed circuit boards, semiconductor devices, light emitting diodes (LEDs), advanced semiconductor packaging, touch-panel glass, flat panel liquid crystal displays (LCDs) and other high value components. Additionally, it produces high-capacity test and inspection equipment that is critical to control process during the production of multilayer ceramic capacitors (MLCCs). Its equipment ensures that each component meets the electrical and physical tolerances required to perform properly. Lastly, it produces systems that use photonic technology to perform precision inspection for control and defect identification. The Companys Interconnect & Microfabrication Group products address an expanding number of applications and materials on a broad set of substrates, including panels, continuous-feed reels, and discrete three dimensional components or devices.

Interconnect Via Drilling

For electrical interconnect applications, The Compa! nys laser via mic ro fabrication systems target applications that require the ! highest accuracy and smallest via (hole) dimensions to create electrical connections between layers in flexible circuits, high-density circuit boards and IC packages. The Companys microvia drilling technology addresses the rapidly changing applications in IC packages, multichip modules and HDI circuit boards. Its ultraviolet (UV) laser processing systems employ technology in lasers, optics and motion control.

Advanced Microfabrication

The Company offers several platforms that enable customers to perform precision drilling, scribing, cutting, etching, routing or marking on many different types of materials and devices including glass, metal, plastic, paint and ceramics. It also offer laser ablation systems that ablate material for identification and analysis applications, including forensics, mineral analysis and research.

Semiconductor Group (SG)

The Companys Semiconductor Group products address multiple applicatio ns that utilize laser energy to process materials on wafer-based substrates. This includes traditional silicon wafers, LEDs wafers, and new ultrathin silicon wafers used in the three-dimensional (3D) packaging applications. Semiconductor Memory Yield Improvement Systems includes semiconductor memory yield improvement products are designed to cost-effectively enable post-repair yield improvements in the manufacturing of dynamic random access memory (DRAM) memory devices.

3D Semiconductor Wafer Processing

The 3D chip packaging technologies is driving the need for silicon wafers to become thinner in order to allow for stacking of wafers within the same packaging geometry. As wafers become thinner, they become more challenging to cut into discrete chips using traditional mechanical saws. The Companys model 9900 uses a laser to dice ultra-thin silicon wafers, those with a thickness of 50 microns or below, and to singulate interposers. ! In additi! on, th is platform can be used to scribe next generation thin film ! materials! that lend themselves to laser processing.

LED Wafer Scribing

The Companys AccuScribe line of sapphire wafer scribing systems is a key component in the manufacture of LEDs. During production, LEDs are created on a thin wafer of synthetic sapphire crystal that must be broken into individual units at the end of the process. The brittle nature of the sapphire wafer requires that it be carefully cut in order to prevent unwanted fractures, yield losses, and lower light output when the wafer is broken apart into discrete LEDs. The AccuScribe systems use a laser to scribe the wafer with a precise groove between individual LEDs. When mechanical force is applied to the wafer, it fractures along these grooves and allows the wafer to be split apart into discrete LEDs. These systems are capable of scribing both standard and high brightness designs for general illumination applications. In addition, this platform can be used to address singulation of various LED packaging materials.

LCD Repair

The Comapny's laser LCD repair systems are critical to improving yields in the manufacture of flat panel displays. During production, individual pixels of a display may develop electrical defects that result in no light emission or the emission of only a steady white light. To correct these defects, flat panel display producers employ a laser repair process to isolate the electrical defects during production by cutting the inputs to the pixel. Its laser systems are primarily sold to the manufacturers of LCD repair tools as a key component of their products.

Semiconductor Systems

The products include industry wafer marking equipment, wafer and circuit trim tools, and LCD repair tools. Wafer marking equipment is used for serialization and wafer identification by both manufacturers of semiconductor wafers and within semiconductor fabs. Wafer and circuit trim too! ls are la! ser systems t hat adjust the electrical performance of semiconductor devic! es or hyb! rid circuits by removing a precise amount of material from one or more circuit components.

Components Group (CG)

The Company designs and manufactures products that combine high-speed small parts handling technology with real-time control systems to provide automated, cost-effective inspection solutions for manufacturers of MLCC and other passive components such as capacitor arrays, inductors, resistors, varistors and hybrid circuits. These components, produced in quantities of trillions of units per year, process analog, digital and high-frequency signals and are used in all electronic products.

The Company provides several types of products and solutions in this market. Its MLCC test systems employ high-speed handling and positioning techniques to precisely load, test and sort MLCCs based on their electrical energy storage capacity, or capacitance, and their electrical energy leakage, or dissipation factor. Its 35XX series is the prod uctive tester. Its 3510 model enables high speed testing of the industrys smallest metric 0402 capacitors used primarily in advanced cell phone and tablet designs. It also produces consumable products, such as carrier plates and termination belts, both of which are used to hold MLCCs during the manufacturing and testing process.

The Company competes with Mechanics, Ltd., LPKF Laser & Electronics AG, Mitsubishi Electric Corporation, Orbotech Ltd., InnoLas Systems GmbH, DISCO Corporation, Laser Solutions, Inc., Quantel USA, Inc., Humo Laboratory, Ltd. and HOYA Corporation.

Advisors' Opinion:

• [By Evan Niu, CFA]

  What: Shares of Electro Scientific (NASDAQ: ESIO  ) popped briefly today, up by 11% at the high, after the company reported earnings.

  So what: Revenue in the fiscal fourth quarter totaled $39.6 million, which translated into a non-GAAP net loss of $1 million, or $0.03 per share! . Both fi! gures came out better than expected, as consensus estimates were calling for $38.1 million in revenue and an adjusted loss of $0.07 per share.

• [By Eric Volkman]

  Electro Scientific Industries (NASDAQ: ESIO  ) has a new division under its corporate wing. The company has inked a definitive agreement to purchase the semiconductor systems unit of GSI Group (NASDAQ: GSIG  ) . The terms of the deal were not disclosed.

source from Top Penny Stocks For 2015:http://www.seekpennystocks.com/best-us-companies-to-buy-right-now.html